Stock Price
45.13
Daily Change
-4.80 -9.61%
Monthly
-5.63%
Yearly
146.34%
Q1 Forecast
48.42

Date Reference Time Actual Consensus Previous
2026-05-04 FY2026Q1 PM 0.22 0.09
2026-02-09 FY2025Q4 PM 0.69 0.44 0.43
2025-10-27 FY2025Q3 PM 0.51 0.43 0.49
2025-07-28 FY2025Q2 PM 0.22 0.16 0.27
2025-04-28 FY2025Q1 PM 0.09 0.09 0.24



Peers Price Chg Day Year Date
Taiwan Semiconductor 1,845.00 35.00 1.93% 86.36% Mar/25
Axcelis Technologies 98.35 -2.50 -2.48% 82.87% Mar/26
Advanced Energy Industries 313.28 -29.59 -8.63% 213.22% Mar/26
Applied Materials 338.49 -30.85 -8.35% 129.21% Mar/26
Amkor Technology 45.13 -4.80 -9.61% 146.34% Mar/26
Advanced Semiconductor Engineering 21.53 -0.15 -0.69% 120.82% Mar/24
Azenta 21.31 -0.55 -2.52% -40.01% Mar/26
Cohu 30.23 -1.69 -5.29% 84.78% Mar/26
Daqo New Energy 21.26 0.01 0.05% 10.33% Mar/24
Enphase Energy 40.17 -2.36 -5.55% -33.83% Mar/26

Indexes Price Day Year Date
USND 21408 -521.74 -2.38% 20.24% Mar/26
US2000 2494 -42.76 -1.69% 20.72% Mar/26

Amkor Technology traded at $45.13 this Thursday March 26th, decreasing $4.80 or 9.61 percent since the previous trading session. Looking back, over the last four weeks, Amkor Technology lost 5.63 percent. Over the last 12 months, its price rose by 146.34 percent. Looking ahead, we forecast Amkor Technology to be priced at 48.42 by the end of this quarter and at 44.19 in one year, according to Trading Economics global macro models projections and analysts expectations.

Amkor Technology, Inc. is a providers of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The semiconductor manufacturing process consists of Integrated circuit (IC) design, wafer fabrication, wafer probe, packaging and final test. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. IDMs generally design, manufacture, package and test semiconductors in their own facilities.